data sheet semiconductor http://www.yeashin.com 1 rev.02 20120305 YSCLAMP0524P applications high defi nition multi-media interface (hdmi) digital visual interface (dvi) unifi ed display interface (udi) monitors and flat panel displays mddi ports pci express serial ata iec compatibility iec61000-4-2 (esd) 15kv (air), 8kv (contact) iec61000-4-4 (eft) 40a (5/50 s) slp2510p8 pin configuration ultra low capacitance tvs diode array features 150 watts peak pulse power per line (tp=8/20 s) protects four high-speed i/o lines low clamping voltage working voltages : 5.0v low leakage current mechanical characteristics (2.5x1.0x0.5mm) package molding compound flammability rating : ul 94v-o weight 2.5 millgrams (approximate) quantity per reel : 3,000pcs reel size : 7 inch lead finish : lead free pin configuration device marking YSCLAMP0524P p524 marking code h
http://www.yeashin.com 2 rev.02 20120305 YSCLAMP0524P device characteristics symbol min typ max unit v rwm 5.0 v v br 6.0 v i r 1.0 a v c 15 v c j 0.4 pf v rwm =5v, i/o pin to gnd parameter reverse working voltage 0.8 pf v r =0v, f=1mhz between i/os & gnd i pp =1a, i/o pin to gnd (8/20 s) v r =0v, f=1mhz between i/os c j note 1 : tvs devices are normally selected according to the working peak reverse voltage (vrwm), which should be equal or greater than the dc or continuou s peak operating voltage level. conditions i/o pins to gnd (note 1) i t =1ma, i/o pin to gnd 260 (10 sec.) lead soldering temperature operating temperature range electrical characteristics per line (@ 25 unless otherwise specified) t l watts parameter symbol value 150 p pp storage temperature range t stg -55 ~ 150 units peak pulse power (tp=8/20s waveform) t j -55 ~ 150 maximum ratings (@ 25 unless otherwise specified) breakdown voltage reverse leakage current clamping voltage junction capacitance junction capacitance
http://www.yeashin.com 3 rev.02 20120305 YSCLAMP0524P package outline & dimensions * soldering footprint
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